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29 results
| Picture | Mfr Part # | Unit Price | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Applications | Package / Case | Interface | Supplier Device Package | Voltage - Supply | Core Processor | Number of I/O | RAM Size | Program Memory Type | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||||
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RFQ |
3,824
In-stock
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Microchip Technology | PROD STD IND I2C TPM 4X4 32VQFN | - | Discontinued at Digi-Key | Tray | -40°C ~ 85°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | I²C | 32-VQFN (4x4) | 3.3V | AVR | 4 | - | - | |||
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RFQ |
4,194
In-stock
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Microchip Technology | PROD STD IND I2C TPM 4X4 32VQFN | - | Discontinued at Digi-Key | Tray | -40°C ~ 85°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | I²C | 32-VQFN (4x4) | 3.3V | AVR | 4 | - | - | |||
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RFQ |
5,830
In-stock
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Microchip Technology | PROD STD IND I2C TPM 4X4 32VQFN | - | Discontinued at Digi-Key | Tray | -40°C ~ 85°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | I²C | 32-VQFN (4x4) | 3.3V | AVR | 4 | - | - | |||
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RFQ |
3,197
In-stock
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Microchip Technology | PROD STD COM I2C TPM 4X4 32VQFN | - | Discontinued at Digi-Key | Tray | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | I²C | 32-VQFN (4x4) | 3.3V | AVR | 4 | - | - | |||
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RFQ |
5,014
In-stock
|
Microchip Technology | PROD STD COM I2C TPM 4X4 32VQFN | - | Discontinued at Digi-Key | Tray | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | I²C | 32-VQFN (4x4) | 3.3V | AVR | 4 | - | - | |||
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RFQ |
2,797
In-stock
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Microchip Technology | PRODSTD IND I2C TPM 4X4 32VQFN | - | Obsolete | Tray | -40°C ~ 85°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | I²C | 32-VQFN (4x4) | 3.3V | AVR | 4 | - | - | |||
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RFQ |
5,659
In-stock
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Microchip Technology | PRODSTD COM I2C TPM 4X4 32VQFN | - | Obsolete | Tray | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | I²C | 32-VQFN (4x4) | 3.3V | AVR | 4 | - | - | |||
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4,364
In-stock
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Microchip Technology | PRODSTD COM I2C TPM 4X4 32VQFN | - | Obsolete | Tray | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | I²C | 32-VQFN (4x4) | 3.3V | AVR | 4 | - | - | ||||
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3,968
In-stock
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Microchip Technology | PRODFF COM I2C TPM 4X4 32VQFN | - | Obsolete | Tray | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | I²C | 32-VQFN (4x4) | 3.3V | AVR | 4 | - | - | ||||
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5,188
In-stock
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Microchip Technology | PROD FF IND I2C TPM 4X4 32VQFN S | - | Active | Tray | -40°C ~ 85°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | I²C | 32-VQFN (4x4) | 3.3V | AVR | 4 | - | - | ||||
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4,434
In-stock
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Microchip Technology | PROD FF IND I2C TPM 4X4 32VQFN U | - | Active | Tray | -40°C ~ 85°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | I²C | 32-VQFN (4x4) | 3.3V | AVR | 4 | - | - | ||||
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5,818
In-stock
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Microchip Technology | PROD FF IND I2C TPM 4X4 32VQFN C | - | Active | Tray | -40°C ~ 85°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | I²C | 32-VQFN (4x4) | 3.3V | AVR | 4 | - | - | ||||
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5,207
In-stock
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Microchip Technology | PROD FF COM I2C TPM 4X4 32VQFN S | - | Active | Tray | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | I²C | 32-VQFN (4x4) | 3.3V | AVR | 4 | - | - | ||||
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2,926
In-stock
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Microchip Technology | PROD FF COM I2C TPM 4X4 32VQFN U | - | Active | Tray | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 32-VQFN Exposed Pad | I²C | 32-VQFN (4x4) | 3.3V | AVR | 4 | - | - | ||||
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3,683
In-stock
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Microchip Technology | PROD FF COM I2C TPM 4X4 32VQFN C | - | Active | Tray | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | I²C | 32-VQFN (4x4) | 3.3V | AVR | 4 | - | - | ||||
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5,699
In-stock
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Microchip Technology | FF IND I2C TPM 4.4MM TSSOP SEK | - | Active | Tray | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 28-TSSOP (0.173", 4.40mm Width) | I²C | 28-TSSOP | 3.3V | AVR | 4 | - | - | ||||
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3,294
In-stock
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Microchip Technology | FF IND I2C TPM 4.4MM TSSOP UEK | - | Active | Tray | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 28-TSSOP (0.173", 4.40mm Width) | I²C | 28-TSSOP | 3.3V | AVR | 4 | - | - | ||||
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5,908
In-stock
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Microchip Technology | FF COM I2C TPM 4.4MM TSSOP SEK | - | Active | Tray | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 28-TSSOP (0.173", 4.40mm Width) | I²C | 28-TSSOP | 3.3V | AVR | 4 | - | - | ||||
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3,348
In-stock
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Microchip Technology | FF COM I2C TPM 4.4MM TSSOP UEK | - | Active | Tray | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 28-TSSOP (0.173", 4.40mm Width) | I²C | 28-TSSOP | 3.3V | AVR | 4 | - | - | ||||
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4,245
In-stock
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Microchip Technology | IC EMBEDDED CTLR 169LFBGA | - | Active | Tray | 0°C ~ 85°C | Surface Mount | I/O Controller | 169-LFBGA | ACPI, BC-Link, I²C/SMBus, LPC, PECI, PS/2, SPI | 169-LFBGA (11x11) | 3.3V | ARC-625D | 135 | 16KB | FLASH (192 kB) | ||||
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4,286
In-stock
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Microchip Technology | IC EMBEDDED CTLR 144TFBGA | - | Active | Tray | 0°C ~ 70°C | Surface Mount | I/O Controller | 144-TFBGA | ACPI, BC-Link, I²C/SMBus, LPC, PECI, PS/2, SPI, VLPC | 144-TFBGA (7x7) | 3.3V | ARC-625D | 115 | 16KB | FLASH (192 kB) | ||||
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4,636
In-stock
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Microchip Technology | IC EMBEDDED CTLR | - | Active | Tray | 0°C ~ 70°C | Surface Mount | I/O Controller | 144-LFBGA | ACPI, BC-Link, I²C/SMBus, LPC, PECI, PS/2, SPI, VLPC | 144-LFBGA (10x10) | 3.3V | ARC-625D | 115 | 16KB | FLASH (192 kB) | ||||
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5,030
In-stock
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Microchip Technology | IC EMBEDDED CTLR | - | Active | Tray | 0°C ~ 85°C | Surface Mount | I/O Controller | 144-TFBGA | ACPI, BC-Link, I²C/SMBus, LPC, PECI, PS/2, SPI | 144-TFBGA (7x7) | 3.3V | 8051 | 56 | 64kb | - | ||||
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4,318
In-stock
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Microchip Technology | PRODFF IND SPI TPM 4X4 32VQFN | - | Active | Tray | -40°C ~ 85°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | SPI | 32-VQFN (4x4) | 3.3V | AVR | 4 | - | - | ||||
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5,092
In-stock
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Microchip Technology | PRODSTD IND SPI TPM 4X4 32VQFN | - | Active | Tray | -40°C ~ 85°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | SPI | 32-VQFN (4x4) | 3.3V | AVR | 4 | - | - | ||||
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4,570
In-stock
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Microchip Technology | PRODFF COM SPI TPM 4X4 32VQFN | - | Active | Tray | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | SPI | 32-VQFN (4x4) | 3.3V | AVR | 4 | - | - | ||||
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5,768
In-stock
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Microchip Technology | PRODSTD COM SPI TPM 4X4 32VQFN | - | Active | Tray | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | SPI | 32-VQFN (4x4) | 3.3V | AVR | 4 | - | - | ||||
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3,239
In-stock
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Microchip Technology | FF COM SPI TPM 4X4 32VQFN CEK | - | Active | Tray | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | SPI | 32-VQFN (4x4) | 3.3V | AVR | 4 | - | - | ||||
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4,744
In-stock
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Microchip Technology | IC EMBEDDED CTLR 128TQFP | - | Active | Tray | 0°C ~ 85°C | Surface Mount | I/O Controller | 128-TQFP | ACPI, BC-Link, I²C/SMBus, LPC, PECI, PS/2, SPI | 128-VTQFP (14x14) | 3.3V | 8051 | 56 | 64kb | - | ||||
