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42 results
| Picture | Mfr Part # | Unit Price | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Applications | Package / Case | Interface | Supplier Device Package | Voltage - Supply | Core Processor | Number of I/O | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | ||||||||||||||||||||
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RFQ |
3,805
In-stock
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Microchip Technology | IC CRYPTO TPM 40QFN | - | Active | Tape & Reel (TR) | 0°C ~ 70°C | - | Trusted Platform Module (TPM) | - | SPI | - | 3.3V | AVR | 4 | |||
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RFQ |
3,904
In-stock
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Microchip Technology | IC CRYPTO TPM 40QFN | - | Active | - | 0°C ~ 70°C | - | Trusted Platform Module (TPM) | - | I²C | - | 3.3V | AVR | 4 | |||
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5,235
In-stock
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Microchip Technology | FF IND I2C TPM 4X4 32VQFN CEK | - | Active | Tape & Reel (TR) | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | I²C | 32-VQFN (4x4) | 3.3V | AVR | 4 | ||||
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3,252
In-stock
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Microchip Technology | FF COM I2C TPM 4X4 32VQFN CEK | - | Active | Tape & Reel (TR) | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | I²C | 32-VQFN (4x4) | 3.3V | AVR | 4 | ||||
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3,366
In-stock
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Microchip Technology | FF IND I2C TPM 4.4MM TSSOP SEK | - | Active | Tape & Reel (TR) | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 28-TSSOP (0.173", 4.40mm Width) | I²C | 28-TSSOP | 3.3V | AVR | 4 | ||||
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3,999
In-stock
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Microchip Technology | FF IND I2C TPM 4.4MM TSSOP UEK | - | Active | Tape & Reel (TR) | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 28-TSSOP (0.173", 4.40mm Width) | I²C | 28-TSSOP | 3.3V | AVR | 4 | ||||
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4,752
In-stock
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Microchip Technology | IC CRYPTO TPM 28TSSOP | - | Active | Tape & Reel (TR) | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 28-TSSOP (0.173", 4.40mm Width) | SPI | 28-TSSOP | 3.3V | AVR | 4 | ||||
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4,194
In-stock
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Microchip Technology | FF COM I2C TPM 4.4MM TSSOP SEK | - | Active | Tape & Reel (TR) | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 28-TSSOP (0.173", 4.40mm Width) | I²C | 28-TSSOP | 3.3V | AVR | 4 | ||||
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2,894
In-stock
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Microchip Technology | FF COM I2C TPM 4.4MM TSSOP UEK | - | Active | Tape & Reel (TR) | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 28-TSSOP (0.173", 4.40mm Width) | I²C | 28-TSSOP | 3.3V | AVR | 4 | ||||
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5,188
In-stock
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Microchip Technology | PROD FF IND I2C TPM 4X4 32VQFN S | - | Active | Tray | -40°C ~ 85°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | I²C | 32-VQFN (4x4) | 3.3V | AVR | 4 | ||||
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4,434
In-stock
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Microchip Technology | PROD FF IND I2C TPM 4X4 32VQFN U | - | Active | Tray | -40°C ~ 85°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | I²C | 32-VQFN (4x4) | 3.3V | AVR | 4 | ||||
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5,818
In-stock
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Microchip Technology | PROD FF IND I2C TPM 4X4 32VQFN C | - | Active | Tray | -40°C ~ 85°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | I²C | 32-VQFN (4x4) | 3.3V | AVR | 4 | ||||
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5,207
In-stock
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Microchip Technology | PROD FF COM I2C TPM 4X4 32VQFN S | - | Active | Tray | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | I²C | 32-VQFN (4x4) | 3.3V | AVR | 4 | ||||
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2,926
In-stock
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Microchip Technology | PROD FF COM I2C TPM 4X4 32VQFN U | - | Active | Tray | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 32-VQFN Exposed Pad | I²C | 32-VQFN (4x4) | 3.3V | AVR | 4 | ||||
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3,683
In-stock
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Microchip Technology | PROD FF COM I2C TPM 4X4 32VQFN C | - | Active | Tray | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | I²C | 32-VQFN (4x4) | 3.3V | AVR | 4 | ||||
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5,699
In-stock
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Microchip Technology | FF IND I2C TPM 4.4MM TSSOP SEK | - | Active | Tray | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 28-TSSOP (0.173", 4.40mm Width) | I²C | 28-TSSOP | 3.3V | AVR | 4 | ||||
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5,574
In-stock
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Microchip Technology | FF IND I2C TPM 4X4 32VQFN SEK | - | Active | Tape & Reel (TR) | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | I²C | 32-VQFN (4x4) | 3.3V | AVR | 4 | ||||
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3,294
In-stock
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Microchip Technology | FF IND I2C TPM 4.4MM TSSOP UEK | - | Active | Tray | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 28-TSSOP (0.173", 4.40mm Width) | I²C | 28-TSSOP | 3.3V | AVR | 4 | ||||
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3,078
In-stock
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Microchip Technology | FF IND I2C TPM 4X4 32VQFN UEK | - | Active | Tape & Reel (TR) | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | I²C | 32-VQFN (4x4) | 3.3V | AVR | 4 | ||||
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5,908
In-stock
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Microchip Technology | FF COM I2C TPM 4.4MM TSSOP SEK | - | Active | Tray | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 28-TSSOP (0.173", 4.40mm Width) | I²C | 28-TSSOP | 3.3V | AVR | 4 | ||||
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3,348
In-stock
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Microchip Technology | FF COM I2C TPM 4.4MM TSSOP UEK | - | Active | Tray | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 28-TSSOP (0.173", 4.40mm Width) | I²C | 28-TSSOP | 3.3V | AVR | 4 | ||||
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3,872
In-stock
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Microchip Technology | FF COM I2C TPM 4X4 32VQFN SEK | - | Active | Tape & Reel (TR) | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | I²C | 32-VQFN (4x4) | 3.3V | AVR | 4 | ||||
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3,061
In-stock
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Microchip Technology | FF COM I2C TPM 4X4 32VQFN UEK | - | Active | Tape & Reel (TR) | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | I²C | 32-VQFN (4x4) | 3.3V | AVR | 4 | ||||
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3,107
In-stock
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Microchip Technology | FF IND SPI TPM 4X4 32VQFN SEK - | - | Active | Tape & Reel (TR) | -40°C ~ 85°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | SPI | 32-VQFN (4x4) | 3.3V | AVR | 4 | ||||
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3,766
In-stock
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Microchip Technology | PROD FF IND SPI TPM 4X4 32VQFN S | - | Active | Tape & Reel (TR) | -40°C ~ 85°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | SPI | 32-VQFN (4x4) | 3.3V | AVR | 4 | ||||
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4,934
In-stock
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Microchip Technology | FF IND SPI TPM 4X4 32VQFN UEK - | - | Active | Tape & Reel (TR) | -40°C ~ 85°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | SPI | 32-VQFN (4x4) | 3.3V | AVR | 4 | ||||
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5,205
In-stock
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Microchip Technology | PROD FF IND SPI TPM 4X4 32VQFN S | - | Active | Tape & Reel (TR) | -40°C ~ 85°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | SPI | 32-VQFN (4x4) | 3.3V | AVR | 4 | ||||
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4,931
In-stock
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Microchip Technology | FF IND SPI TPM 4X4 32VQFN CEK - | - | Active | Tape & Reel (TR) | -40°C ~ 85°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | SPI | 32-VQFN (4x4) | 3.3V | AVR | 4 | ||||
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5,539
In-stock
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Microchip Technology | PROD FF COM SPI TPM 4X4 32VQFN S | - | Active | Tape & Reel (TR) | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | SPI | 32-VQFN (4x4) | 3.3V | AVR | 4 | ||||
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4,256
In-stock
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Microchip Technology | FF COM SPI TPM 4X4 32VQFN SEK - | - | Active | Tape & Reel (TR) | 0°C ~ 70°C | Surface Mount | Trusted Platform Module (TPM) | 32-VFQFN Exposed Pad | SPI | 32-VQFN (4x4) | 3.3V | AVR | 4 | ||||
