- Part Status :
- Operating Temperature :
- Supplier Device Package :
-
- 176-LQFP (24x24) (15)
- 208-LQFP (28x28) (2)
- 208-MAPBGA (17x17) (3)
- 252-MAPBGA (17x17) (1)
- 256-MAPPBGA (17x17) (7)
- 324-MAPBGA (19x19) (1)
- 324-PBGA (23x23) (2)
- 324-TEPBGA (23x23) (3)
- 416-PBGA (27x27) (2)
- 516-FPBGA (27x27) (3)
- 516-MAPBGA (27x27) (2)
- 516-PBGA (27x27) (1)
- PG-BGA-416 (2)
- PG-BGA-416-10 (2)
- PG-BGA-416-27 (1)
- PG-LFBGA-292 (1)
- PG-LFBGA-292-6 (2)
- PG-LQFP-176-22 (1)
- Core Size :
- Connectivity :
-
- ASC, CAN, EBI/EMI, FlexRay, MLI, MSC, SSC (3)
- ASC, CAN, EBI/EMI, MLI, MSC, SSC (2)
- ASC, CAN, Ethernet, FlexRay, HSSL, I²C, LIN, MSC, PSI5, QSPI, SENT (5)
- ASC, CAN, FlexRay, MLI, MSC, SSC (1)
- CAN, EBI/EMI, Ethernet, I²C, LIN, SPI (4)
- CAN, EBI/EMI, LIN, SCI, SPI (13)
- CAN, EBI/EMI, SCI, SPI (4)
- CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG (18)
- CAN, Ethernet, I²C, LIN, SCI, SPI, UART/USART (1)
- CAN, SCI, SPI (2)
- Oscillator Type :
- Applied Filters :
53 results
| Picture | Mfr Part # | Unit Price | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Speed | Voltage - Supply (Vcc/Vdd) | Number of I/O | RAM Size | Core Size | Connectivity | Program Memory Size | Program Memory Type | EEPROM Size | Data Converters | Oscillator Type | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | |||||||||||||||||||||||||||
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2,673
In-stock
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NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORE | MPC56xx Qorivva | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 516-BBGA | 516-FPBGA (27x27) | DMA, POR, PWM | e200z7 | 264MHz | 1.08 V ~ 5.25 V | 32 | 256K x 8 | 32-Bit | CAN, EBI/EMI, SCI, SPI | 4MB (4M x 8) | Flash | - | A/D 64x12b | External | ||||
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5,618
In-stock
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NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORE | MPC56xx Qorivva | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 516-BBGA | 516-FPBGA (27x27) | DMA, POR, PWM | e200z7 | 264MHz | 1.08 V ~ 5.25 V | 32 | 256K x 8 | 32-Bit | CAN, EBI/EMI, SCI, SPI | 4MB (4M x 8) | Flash | - | A/D 64x12b | External | ||||
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5,873
In-stock
|
NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORE | MPC56xx Qorivva | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 516-BBGA | 516-FPBGA (27x27) | DMA, POR, PWM | e200z7 | 264MHz | 1.08 V ~ 5.25 V | 32 | 256K x 8 | 32-Bit | CAN, EBI/EMI, SCI, SPI | 4MB (4M x 8) | Flash | - | A/D 64x12b | External | ||||
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3,497
In-stock
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NXP USA Inc. | IC MCU 32BIT 4MB FLASH 516BGA | MPC56xx Qorivva | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 516-BBGA | 516-PBGA (27x27) | DMA, POR, PWM | e200z7 | 264MHz | 1.08 V ~ 5.25 V | 32 | 256K x 8 | 32-Bit | CAN, EBI/EMI, SCI, SPI | 4MB (4M x 8) | Flash | - | A/D 64x12b | External | ||||
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3,119
In-stock
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NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORE | MPC56xx Qorivva | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | DMA, POR, PWM | e200z7 | 264MHz | 1.08 V ~ 5.25 V | 32 | 256K x 8 | 32-Bit | CAN, SCI, SPI | 4MB (4M x 8) | Flash | - | A/D 64x12b | External | ||||
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3,068
In-stock
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NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORE | MPC56xx Qorivva | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | DMA, POR, PWM | e200z7 | 264MHz | 1.08 V ~ 5.25 V | 32 | 256K x 8 | 32-Bit | CAN, SCI, SPI | 4MB (4M x 8) | Flash | - | A/D 64x12b | External | ||||
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3,587
In-stock
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NXP USA Inc. | IC MCU 32BIT 4MB FLASH 324TEBGA | MPC56xx Qorivva | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 324-BBGA | 324-TEPBGA (23x23) | DMA, POR, PWM, WDT | e200z4 | 150MHz | 1.14 V ~ 5.25 V | 151 | 192K x 8 | 32-Bit | CAN, EBI/EMI, LIN, SCI, SPI | 4MB (4M x 8) | Flash | - | A/D 40x12b | Internal | ||||
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4,178
In-stock
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NXP USA Inc. | IC MCU 32BIT 4MB FLASH 256MAPBGA | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 178 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 4MB (4M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | ||||
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5,866
In-stock
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NXP USA Inc. | ARM 32-BIT MCU TRIPLE CORE 4MB | MAC57Dxxx | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 516-BGA | 516-MAPBGA (27x27) | DMA, LCD, LVD/HVD, POR, PWM, WDT | ARM® Cortex®-A5, -M4, -M0+ | 80MHz, 160MHz, 320MHz | 3.15 V ~ 5.5 V | - | 2.3M x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, I²C, LIN, SPI | 4MB (4M x 8) | Flash | - | A/D 24x12b | Internal | ||||
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3,043
In-stock
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NXP USA Inc. | ARM 32-BIT MCU TRIPLE CORE 4MB | MAC57Dxxx | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 516-BGA | 516-MAPBGA (27x27) | DMA, LCD, LVD/HVD, POR, PWM, WDT | ARM® Cortex®-A5, -M4, -M0+ | 80MHz, 160MHz, 320MHz | 3.15 V ~ 5.5 V | - | 2.3M x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, I²C, LIN, SPI | 4MB (4M x 8) | Flash | - | A/D 24x12b | Internal | ||||
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4,665
In-stock
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NXP USA Inc. | IC MCU 32BIT 4MB FLASH 176LQFP | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 129 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 4MB (4M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | ||||
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2,621
In-stock
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NXP USA Inc. | IC MCU 32BIT 4MB FLASH 256MAPBGA | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 178 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 4MB (4M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | ||||
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5,359
In-stock
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NXP USA Inc. | IC MCU 32BIT 4MB FLASH 176LQFP | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 129 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 4MB (4M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | ||||
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4,173
In-stock
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NXP USA Inc. | IC MCU 32BIT 4MB FLASH 256MAPBGA | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 85°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 178 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 4MB (4M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | ||||
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5,731
In-stock
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NXP USA Inc. | IC MCU 32BIT 4MB FLASH 256MAPBGA | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 85°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/120MHz | 3 V ~ 5.5 V | 178 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 4MB (4M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | ||||
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RFQ |
4,686
In-stock
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Infineon Technologies | IC MCU 32BIT 4MB FLASH 416BGA | TC11xx | Obsolete | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 416-BBGA | PG-BGA-416-10 | DMA, POR, WDT | TriCore™ | 180MHz | 1.42 V ~ 1.58 V | 219 | 224K x 8 | 32-Bit | ASC, CAN, EBI/EMI, MLI, MSC, SSC | 4MB (4M x 8) | Flash | - | A/D 48x12b | Internal | |||
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4,301
In-stock
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Infineon Technologies | IC MCU 32BIT 4MB FLASH 416BGA | TC17xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 416-BGA | PG-BGA-416 | DMA, POR, WDT | TriCore™ | 270MHz | 1.17 V ~ 3.63 V | 221 | 288K x 8 | 32-Bit | ASC, CAN, EBI/EMI, FlexRay, MLI, MSC, SSC | 4MB (4M x 8) | Flash | 192K x 8 | A/D 8x10b, 44x12b | External | ||||
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3,497
In-stock
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Infineon Technologies | IC MCU 32BIT 4MB FLASH 416BGA | TC17xx | Not For New Designs | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 416-BGA | PG-BGA-416 | DMA, POR, WDT | TriCore™ | 270MHz | 1.17 V ~ 3.63 V | 221 | 288K x 8 | 32-Bit | ASC, CAN, EBI/EMI, FlexRay, MLI, MSC, SSC | 4MB (4M x 8) | Flash | 192K x 8 | A/D 8x10b, 44x12b | External | ||||
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RFQ |
3,862
In-stock
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NXP USA Inc. | IC MCU 32BIT 4MB FLASH 208MAPBGA | MPC56xx Qorivva | Obsolete | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 208-BGA | 208-MAPBGA (17x17) | DMA, POR, PWM, WDT | e200z4 | 150MHz | 1.14 V ~ 5.25 V | 120 | 192K x 8 | 32-Bit | CAN, EBI/EMI, LIN, SCI, SPI | 4MB (4M x 8) | Flash | - | A/D 40x12b | Internal | |||
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3,628
In-stock
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STMicroelectronics | IC MCU 32BIT 4MB FLASH 324BGA | Automotive, AEC-Q100, SPC56 | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 324-BGA | 324-PBGA (23x23) | DMA, POR, PWM, WDT | e200z4 | 150MHz | 1.14 V ~ 1.32 V | 190 | 192K x 8 | 32-Bit | CAN, EBI/EMI, LIN, SCI, SPI | 4MB (4M x 8) | Flash | - | A/D 40x12b | Internal | ||||
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4,165
In-stock
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Infineon Technologies | IC MCU 32BIT 4MB FLASH 292LFBGA | TC17xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 292-LFBGA | PG-LFBGA-292-6 | DMA, POR, WDT | TriCore™ | 240MHz | 1.17 V ~ 3.63 V | 128 | 288K x 8 | 32-Bit | ASC, CAN, FlexRay, MLI, MSC, SSC | 4MB (4M x 8) | Flash | 192K x 8 | A/D 8x10b, 44x12b | External | ||||
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2,737
In-stock
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STMicroelectronics | IC MCU 32BIT 4MB FLASH 176LQFP | Automotive, AEC-Q100, SPC56 | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 176-LQFP | 176-LQFP (24x24) | DMA, POR, PWM, WDT | e200z4 | 120MHz | 1.14 V ~ 1.32 V | 118 | 192K x 8 | 32-Bit | CAN, EBI/EMI, LIN, SCI, SPI | 4MB (4M x 8) | Flash | - | A/D 34x12b | Internal | ||||
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4,457
In-stock
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STMicroelectronics | IC MCU 32BIT 4MB FLASH 176LQFP | Automotive, AEC-Q100, SPC56 | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 176-LQFP | 176-LQFP (24x24) | DMA, POR, PWM, WDT | e200z4 | 120MHz | 1.14 V ~ 1.32 V | 118 | 192K x 8 | 32-Bit | CAN, EBI/EMI, LIN, SCI, SPI | 4MB (4M x 8) | Flash | - | A/D 34x12b | Internal | ||||
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RFQ |
5,054
In-stock
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Infineon Technologies | IC MCU 32BIT 4MB FLASH 416BGA | TC17xx | Obsolete | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 416-BBGA | PG-BGA-416-10 | DMA, POR, WDT | TriCore™ | 180MHz | 1.42 V ~ 1.58 V | 219 | 224K x 8 | 32-Bit | ASC, CAN, EBI/EMI, MLI, MSC, SSC | 4MB (4M x 8) | Flash | - | A/D 48x12b | External | |||
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4,349
In-stock
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NXP USA Inc. | IC MCU 32BIT 4MB FLASH 324TEBGA | MPC56xx Qorivva | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 324-BBGA | 324-TEPBGA (23x23) | DMA, POR, PWM, WDT | e200z4 | 120MHz | 1.14 V ~ 5.25 V | 151 | 192K x 8 | 32-Bit | CAN, EBI/EMI, LIN, SCI, SPI | 4MB (4M x 8) | Flash | - | A/D 40x12b | Internal | ||||
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2,900
In-stock
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NXP USA Inc. | NXP 32-BIT MCU TRIPLE CORE 4MB | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, LVD, POR, WDT | e200z2, e200z4, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 129 | 768K x 8 | 32-Bit Tri-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 4MB (4M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | ||||
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5,088
In-stock
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NXP USA Inc. | ULTRA RELIABLE MCU WITH VAST PER | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, LVD, POR, WDT | e200z2, e200z4, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 129 | 768K x 8 | 32-Bit Tri-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 4MB (4M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | ||||
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3,753
In-stock
|
NXP USA Inc. | DUAL CORE 4M FLASH 512K RAM F | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, LVD, POR, WDT | e200z2, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 178 | 512K x 8 | 32-Bit Dual-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 4MB (4M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | ||||
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5,161
In-stock
|
NXP USA Inc. | IC MCU 32BIT 4MB FLASH 324TEBGA | MPC56xx Qorivva | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 324-BBGA | 324-TEPBGA (23x23) | DMA, POR, PWM, WDT | e200z4 | 80MHz | 1.14 V ~ 5.25 V | 151 | 192K x 8 | 32-Bit | CAN, EBI/EMI, LIN, SCI, SPI | 4MB (4M x 8) | Flash | - | A/D 40x12b | Internal | ||||
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5,324
In-stock
|
NXP USA Inc. | IC MCU 32BIT 4MB FLASH 176LQFP | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, LVD, POR, WDT | e200z2, e200z4, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 129 | 768K x 8 | 32-Bit Tri-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 4MB (4M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | ||||
