- Series :
- Packaging :
- Operating Temperature :
- Package / Case :
- Supplier Device Package :
- Core Processor :
- Speed :
- RAM Size :
- Core Size :
- Connectivity :
-
- CAN, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, MMC/SD, SPI, SSI, SSP, UART/USART, USB (2)
- CAN, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG (3)
- CAN, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG (4)
- CAN, EBI/EMI, I²C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART (1)
- CAN, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART (2)
- CAN, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG (2)
- Program Memory Size :
- Program Memory Type :
- Data Converters :
- Applied Filters :
14 results
Picture | Mfr Part # | Unit Price | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Speed | Voltage - Supply (Vcc/Vdd) | Number of I/O | RAM Size | Core Size | Connectivity | Program Memory Size | Program Memory Type | EEPROM Size | Data Converters | Oscillator Type | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
GLOBAL STOCKS | |||||||||||||||||||||||||||
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3,629
In-stock
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NXP USA Inc. | IC MCU 32BIT ROMLESS 144LQFP | LPC18xx | Active | Tray | -40°C ~ 85°C (TA) | 144-LQFP | 144-LQFP (20x20) | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | ARM® Cortex®-M3 | 180MHz | 2.2 V ~ 3.6 V | 83 | 200K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, MMC/SD, SPI, SSI, SSP, UART/USART, USB | - | ROMless | - | A/D 8x10b; D/A 1x10b | Internal | ||||
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5,359
In-stock
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NXP USA Inc. | IC MCU 32BIT ROMLESS 144LQFP | LPC18xx | Active | Tray | -40°C ~ 85°C (TA) | 144-LQFP | 144-LQFP (20x20) | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | ARM® Cortex®-M3 | 180MHz | 2.2 V ~ 3.6 V | 83 | 200K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG | - | ROMless | - | A/D 8x10b; D/A 1x10b | Internal | ||||
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2,832
In-stock
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NXP USA Inc. | IC MCU 32BIT ROMLESS 144LQFP | LPC18xx | Active | Tray | -40°C ~ 85°C (TA) | 144-LQFP | 144-LQFP (20x20) | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | ARM® Cortex®-M3 | 180MHz | 2.2 V ~ 3.6 V | 83 | 136K x 8 | 32-Bit | CAN, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART | - | ROMless | - | A/D 8x10b; D/A 1x10b | Internal | ||||
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5,499
In-stock
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NXP USA Inc. | IC MCU 32BIT ROMLESS 100TFBGA | LPC43xx | Active | Tape & Reel (TR) | -40°C ~ 85°C (TA) | 100-TFBGA | 100-TFBGA (9x9) | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | ARM® Cortex®-M4/M0 | 204MHz | 2.2 V ~ 3.6 V | 49 | 264K x 8 | 32-Bit Dual-Core | CAN, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG | - | ROMless | - | A/D 4x10b; D/A 1x10b | Internal | ||||
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4,247
In-stock
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NXP USA Inc. | IC MCU 32BIT ROMLESS 100TFBGA | LPC43xx | Active | Tray | -40°C ~ 85°C (TA) | 100-TFBGA | 100-TFBGA (9x9) | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | ARM® Cortex®-M4/M0 | 204MHz | 2.2 V ~ 3.6 V | 49 | 264K x 8 | 32-Bit Dual-Core | CAN, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG | - | ROMless | - | A/D 4x10b; D/A 1x10b | Internal | ||||
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3,274
In-stock
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NXP USA Inc. | IC MCU 32BIT ROMLESS 180TFBGA | LPC18xx | Active | Tray | -40°C ~ 85°C (TA) | 180-TFBGA | 180-TFBGA (12x12) | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | ARM® Cortex®-M3 | 180MHz | 2.2 V ~ 3.6 V | 118 | 200K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG | - | ROMless | - | A/D 8x10b; D/A 1x10b | Internal | ||||
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3,782
In-stock
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NXP USA Inc. | IC MCU 32BIT ROMLESS 144LQFP | LPC18xx | Active | Tray | -40°C ~ 85°C (TA) | 144-LQFP | - | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | ARM® Cortex®-M3 | 180MHz | 2.2 V ~ 3.6 V | 83 | 200K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG | - | ROMless | - | A/D 8x10b; D/A 1x10b | Internal | ||||
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3,950
In-stock
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NXP USA Inc. | IC MCU 32BIT ROMLESS 256LBGA | LPC18xx | Active | Tray | -40°C ~ 85°C (TA) | 256-LBGA | 256-LBGA (17x17) | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | ARM® Cortex®-M3 | 180MHz | 2.2 V ~ 3.6 V | 164 | 200K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG | - | ROMless | - | A/D 8x10b; D/A 1x10b | Internal | ||||
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5,147
In-stock
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NXP USA Inc. | IC MCU 32BIT ROMLESS 100TFBGA | LPC43xx | Active | Tray | -40°C ~ 85°C (TA) | 100-TFBGA | 100-TFBGA (9x9) | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | ARM® Cortex®-M4/M0 | 204MHz | 2.2 V ~ 3.6 V | 49 | 168K x 8 | 32-Bit Dual-Core | CAN, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART | - | ROMless | - | A/D 4x10b; D/A 1x10b | Internal | ||||
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4,796
In-stock
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NXP USA Inc. | IC MCU 32BIT ROMLESS 256LBGA | LPC18xx | Active | Tray | -40°C ~ 85°C (TA) | 256-LBGA | 256-LBGA (17x17) | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | ARM® Cortex®-M3 | 180MHz | 2.2 V ~ 3.6 V | 164 | 200K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, MMC/SD, SPI, SSI, SSP, UART/USART, USB | - | ROMless | - | A/D 8x10b; D/A 1x10b | Internal | ||||
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3,396
In-stock
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NXP USA Inc. | IC MCU 32BIT ROMLESS 144LQFP | LPC18xx | Active | Tray | -40°C ~ 85°C (TA) | 144-LQFP | 144-LQFP (20x20) | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | ARM® Cortex®-M3 | 180MHz | 2.2 V ~ 3.6 V | 83 | 136K x 8 | 32-Bit | CAN, EBI/EMI, I²C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART | - | ROMless | - | A/D 8x10b; D/A 1x10b | Internal | ||||
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3,543
In-stock
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NXP USA Inc. | IC MCU 32BIT ROMLESS 100TFBGA | LPC43xx | Active | Tray | -40°C ~ 85°C (TA) | 100-TFBGA | 100-TFBGA (9x9) | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | ARM® Cortex®-M4/M0 | 204MHz | 2.2 V ~ 3.6 V | 49 | 200K x 8 | 32-Bit Dual-Core | CAN, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG | - | ROMless | - | A/D 4x10b; D/A 1x10b | Internal | ||||
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5,671
In-stock
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NXP USA Inc. | IC MCU 32BIT 512KB FLASH 256LBGA | LPC43xx | Active | Tray | -40°C ~ 105°C (TA) | 256-LBGA | 256-LBGA (17x17) | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | ARM® Cortex®-M4/M0 | 204MHz | 2.2 V ~ 3.6 V | 164 | 136K x 8 | 32-Bit Dual-Core | CAN, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG | 512KB (512K x 8) | Flash | 16K x 8 | A/D 8x10b; D/A 1x10b | Internal | ||||
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4,661
In-stock
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NXP USA Inc. | IC MCU 32BIT ROMLESS 144LQFP | LPC18xx | Active | Tray | -40°C ~ 85°C (TA) | 144-LQFP | 144-LQFP (20x20) | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT | ARM® Cortex®-M3 | 180MHz | 2.2 V ~ 3.6 V | 83 | 168K x 8 | 32-Bit | CAN, EBI/EMI, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG | - | ROMless | - | A/D 8x10b; D/A 1x10b | Internal |