- Part Status :
- Operating Temperature :
- Core Processor :
- Voltage - Supply (Vcc/Vdd) :
- Core Size :
- Connectivity :
-
- CAN, EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI (9)
- CAN, EBI/EMI, Ethernet, FlexRAY, I²C, LIN, SPI, PSI, UART/USART (2)
- CAN, Ethernet, FlexRay, LIN, SPI, UART/USART (14)
- CAN, Ethernet, FlexRay, I²C, LIN, SPI (9)
- CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG (61)
- EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI (4)
- Applied Filters :
99 results
| Picture | Mfr Part # | Unit Price | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Speed | Voltage - Supply (Vcc/Vdd) | Number of I/O | RAM Size | Core Size | Connectivity | Program Memory Size | Program Memory Type | EEPROM Size | Data Converters | Oscillator Type | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | |||||||||||||||||||||||||||
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RFQ |
4,580
In-stock
|
NXP USA Inc. | IC MCU 32BIT 8MB FLASH 516BGA | MPC57xx | Obsolete | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 516-BGA | 516-MAPBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 264MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Tri-Core | EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI | 8MB (8M x 8) | Flash | - | A/D 16b Sigma-Delta, eQADC | Internal | |||
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RFQ |
5,802
In-stock
|
NXP USA Inc. | IC MCU 32BIT 8MB FLASH 416BGA | MPC57xx | Obsolete | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 416-BGA | 416-MAPBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 264MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Tri-Core | EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI | 8MB (8M x 8) | Flash | - | A/D 16b Sigma-Delta, eQADC | Internal | |||
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4,020
In-stock
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NXP USA Inc. | NXP 32-BIT MCU QUAD POWER ARCH | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 512-FBGA | 512-TEPBGA (25x25) | DMA, LVD, POR, Zipwire | e200z7 | 300MHz | 3 V ~ 5.5 V | - | 404K x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, FlexRAY, I²C, LIN, SPI, PSI, UART/USART | 8.64MB (8M x 8) | Flash | - | A/D 12b SAR, 16b Sigma-Delta | Internal | ||||
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4,459
In-stock
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NXP USA Inc. | NXP 32-BIT MCU QUAD POWER ARCH | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 300MHz | 3 V ~ 5.5 V | - | 404K x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, FlexRAY, I²C, LIN, SPI, PSI, UART/USART | 8.64MB (8M x 8) | Flash | - | A/D 12b SAR, 16b Sigma-Delta | Internal | ||||
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2,851
In-stock
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NXP USA Inc. | ULTRA RELIABLE MCU WITH VAST PER | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 324-LFBGA | 324-MAPBGA (19x19) | DMA, LVD, POR, WDT | e200z2, e200z4, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 246 | 768K x 8 | 32-Bit Tri-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 6MB (6M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | ||||
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4,078
In-stock
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NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORES | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 416-BGA | 416-MAPBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 264MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI | 8MB (8M x 8) | Flash | - | A/D 16b Sigma-Delta, eQADC | Internal | ||||
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5,427
In-stock
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NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORES | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 516-BGA | 516-MAPBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 264MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI | 8MB (8M x 8) | Flash | - | A/D 16b Sigma-Delta, eQADC | Internal | ||||
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3,835
In-stock
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NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORES | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 516-BGA | 516-MAPBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 264MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI | 8MB (8M x 8) | Flash | - | A/D 16b Sigma-Delta, eQADC | Internal | ||||
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3,411
In-stock
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NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORES | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 516-BGA | 516-MAPBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 264MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI | 8MB (8M x 8) | Flash | - | A/D 16b Sigma-Delta, eQADC | Internal | ||||
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2,965
In-stock
|
NXP USA Inc. | ULTRA RELIABLE MCU WITH VAST PER | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, LVD, POR, WDT | e200z2, e200z4, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 178 | 768K x 8 | 32-Bit Tri-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 6MB (6M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | ||||
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5,930
In-stock
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NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORES | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 516-BGA | 516-MAPBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 264MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI | 8MB (8M x 8) | Flash | - | A/D 16b Sigma-Delta, eQADC | Internal | ||||
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2,664
In-stock
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NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORES | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 516-BGA | 516-MAPBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 264MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Tri-Core | EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI | 8MB (8M x 8) | Flash | - | A/D 16b Sigma-Delta, eQADC | Internal | ||||
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5,347
In-stock
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NXP USA Inc. | TRIPLE CORE 6M FLASH 768K RAM | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, LVD, POR, WDT | e200z2, e200z4, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 178 | 768K x 8 | 32-Bit Tri-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 6MB (6M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | ||||
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3,534
In-stock
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NXP USA Inc. | IC MCU 32BIT 6MB FLASH 256MAPBGA | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, LVD, POR, WDT | e200z2, e200z4, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 178 | 768K x 8 | 32-Bit Tri-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 6MB (6M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | ||||
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5,374
In-stock
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NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORES | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 416-BGA | 416-MAPBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 264MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI | 8MB (8M x 8) | Flash | - | A/D 16b Sigma-Delta, eQADC | Internal | ||||
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4,666
In-stock
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NXP USA Inc. | ULTRA RELIABLE MCU WITH VAST PER | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, LVD, POR, WDT | e200z2, e200z4, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 129 | 768K x 8 | 32-Bit Tri-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 6MB (6M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | ||||
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2,701
In-stock
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NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORES | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 416-BGA | 416-MAPBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 264MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI | 8MB (8M x 8) | Flash | - | A/D 16b Sigma-Delta, eQADC | Internal | ||||
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3,084
In-stock
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NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORES | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 416-BGA | 416-MAPBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 264MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI | 8MB (8M x 8) | Flash | - | A/D 16b Sigma-Delta, eQADC | Internal | ||||
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3,511
In-stock
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NXP USA Inc. | IC MCU 32BIT 6MB FLASH 256MAPBGA | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, LVD, POR, WDT | e200z2, e200z4, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 178 | 768K x 8 | 32-Bit Tri-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 6MB (6M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | ||||
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5,258
In-stock
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NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORES | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 416-BGA | 416-MAPBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 264MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Tri-Core | CAN, EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI | 8MB (8M x 8) | Flash | - | A/D 16b Sigma-Delta, eQADC | Internal | ||||
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5,455
In-stock
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NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORES | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 416-BGA | 416-MAPBGA (27x27) | DMA, LVD, POR, Zipwire | e200z7 | 264MHz | 3 V ~ 5.5 V | - | 512K x 8 | 32-Bit Tri-Core | EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI | 8MB (8M x 8) | Flash | - | A/D 16b Sigma-Delta, eQADC | Internal | ||||
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2,686
In-stock
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NXP USA Inc. | TRIPLE CORE 6M FLASH 768K RAM | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, LVD, POR, WDT | e200z2, e200z4, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 178 | 768K x 8 | 32-Bit Tri-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 6MB (6M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | ||||
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3,134
In-stock
|
NXP USA Inc. | TRIPLE CORE 6M FLASH 768K RAM | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, LVD, POR, WDT | e200z2, e200z4, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 178 | 768K x 8 | 32-Bit Tri-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 6MB (6M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | ||||
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2,775
In-stock
|
NXP USA Inc. | 32 BIT6MB FLASH768 RAM | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, LVD, POR, WDT | e200z2, e200z4, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 178 | 768K x 8 | 32-Bit Tri-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 6MB (6M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | ||||
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3,514
In-stock
|
NXP USA Inc. | TRIPLE CORE 6M FLASH 768K RAM | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, LVD, POR, WDT | e200z2, e200z4, e200z4 | 80MHz/160MHz | 3 V ~ 5.5 V | 178 | 768K x 8 | 32-Bit Tri-Core | CAN, Ethernet, I²C, LIN, SAI, SPI, USB, USB OTG | 6MB (6M x 8) | Flash | - | A/D 80x10b, 64x12b | Internal | ||||
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3,287
In-stock
|
NXP USA Inc. | 32-BIT MCU DUAL CORE POWER ARCH | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 144-LQFP | 144-LQFP (20x20) | DMA, LVD, POR, WDT | e200z4 | 200MHz | 3.15 V ~ 5.5 V | - | 384K x 8 | 32-Bit Dual-Core | CAN, Ethernet, FlexRay, LIN, SPI, UART/USART | 2.5MB (2.5M x 8) | Flash | - | A/D 64x12b | Internal | ||||
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3,182
In-stock
|
NXP USA Inc. | 32-BIT MCU DUAL CORE POWER ARCH | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 144-LQFP | 144-LQFP (20x20) | DMA, LVD, POR, WDT | e200z4 | 180MHz | 3.15 V ~ 5.5 V | - | 384K x 8 | 32-Bit Dual-Core | CAN, Ethernet, FlexRay, LIN, SPI, UART/USART | 2.5MB (2.5M x 8) | Flash | - | A/D 64x12b | Internal | ||||
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3,820
In-stock
|
NXP USA Inc. | 32 BIT SINGLE CORE 2M FLASH 256K | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | DMA, I²S, POR, WDT | e200z4 | 160MHz | 3.15 V ~ 5.5 V | - | 256K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 2MB (2M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | ||||
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4,188
In-stock
|
NXP USA Inc. | 32-BIT MCU DUAL CORE POWER ARCH | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 144-LQFP | 144-LQFP (20x20) | DMA, LVD, POR, WDT | e200z4 | 200MHz | 3.15 V ~ 5.5 V | - | 256K x 8 | 32-Bit Dual-Core | CAN, Ethernet, FlexRay, LIN, SPI, UART/USART | 2MB (2M x 8) | Flash | - | A/D 64x12b | Internal | ||||
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3,655
In-stock
|
NXP USA Inc. | 2.5MB NVM 2 X E200Z4 CORES 180 | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 144-LQFP | 144-LQFP (20x20) | DMA, LVD, POR, WDT | e200z4 | 180MHz | 3.15 V ~ 5.5 V | - | 384K x 8 | 32-Bit Dual-Core | CAN, Ethernet, FlexRay, LIN, SPI, UART/USART | 2.5MB (2.5M x 8) | Flash | - | A/D 64x12b | Internal | ||||
