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17 results
| Picture | Mfr Part # | Unit Price | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Speed | Voltage - Supply (Vcc/Vdd) | Number of I/O | RAM Size | Core Size | Connectivity | Program Memory Size | Program Memory Type | Oscillator Type | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | |||||||||||||||||||||||||
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RFQ |
5,464
In-stock
|
NXP USA Inc. | IC MCU 32BIT ROMLESS 516FPBGA | MPC51xx | Obsolete | Tray | 0°C ~ 70°C (TA) | 516-BBGA | 516-FPBGA (27x27) | DMA, WDT | e300 | 400MHz | 1.08 V ~ 3.6 V | 147 | 128K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, USB OTG | - | ROMless | External | |||
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RFQ |
3,813
In-stock
|
NXP USA Inc. | IC MCU 32BIT ROMLESS 516FPBGA | MPC5123 | Obsolete | Tray | 0°C ~ 70°C (TA) | 516-BBGA | 516-FPBGA (27x27) | DMA, WDT | e300 | 400MHz | 1.08 V ~ 3.6 V | 147 | 128K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, USB OTG | - | ROMless | External | |||
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RFQ |
4,586
In-stock
|
NXP USA Inc. | IC MCU 32BIT ROMLESS 516FPBGA | MPC5121e | Obsolete | Tray | 0°C ~ 70°C (TA) | 516-BBGA | 516-FPBGA (27x27) | DMA, WDT | e300 | 400MHz | 1.08 V ~ 3.6 V | 147 | 128K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, USB OTG | - | ROMless | External | |||
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RFQ |
4,675
In-stock
|
NXP USA Inc. | IC MCU 32BIT ROMLESS 208LQFP | MCF5301x | Obsolete | Tray | -40°C ~ 85°C (TA) | 208-LQFP | 208-TQFP (28x28) | DMA, PWM, WDT | Coldfire V3 | 240MHz | 1.08 V ~ 3.6 V | 61 | 128K x 8 | 32-Bit | EBI/EMI, Ethernet, I²C, Memory Card, SPI, SSI, UART/USART, USB OTG | - | ROMless | Internal | |||
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RFQ |
5,583
In-stock
|
NXP USA Inc. | IC MCU 32BIT ROMLESS 208LQFP | MCF5301x | Obsolete | Tray | -40°C ~ 85°C (TA) | 208-LQFP | 208-TQFP (28x28) | DMA, PWM, WDT | Coldfire V3 | 240MHz | 1.08 V ~ 3.6 V | 61 | 128K x 8 | 32-Bit | EBI/EMI, Ethernet, I²C, Memory Card, SPI, SSI, UART/USART, USB OTG | - | ROMless | Internal | |||
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RFQ |
3,467
In-stock
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NXP USA Inc. | IC MCU 32BIT ROMLESS 208LQFP | MCF5301x | Obsolete | Tray | -40°C ~ 85°C (TA) | 208-LQFP | 208-TQFP (28x28) | DMA, PWM, WDT | Coldfire V3 | 240MHz | 1.08 V ~ 3.6 V | 61 | 128K x 8 | 32-Bit | EBI/EMI, Ethernet, I²C, Memory Card, SPI, SSI, UART/USART, USB OTG | - | ROMless | Internal | |||
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5,547
In-stock
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NXP USA Inc. | TELEMATICS PROCESSOR W/O MBX GRA | MPC5123 | Active | Tray | -40°C ~ 85°C (TA) | 516-BBGA Exposed Pad | 516-FPBGA (27x27) | DMA, WDT | e300 | 400MHz | 1.08 V ~ 3.6 V | 147 | 128K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, USB OTG | - | ROMless | External | ||||
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3,607
In-stock
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NXP USA Inc. | IC MCU 32BIT ROMLESS 516FPBGA | MPC5123 | Not For New Designs | Tray | -40°C ~ 85°C (TA) | 516-BBGA | 516-FPBGA (27x27) | DMA, WDT | e300 | 400MHz | 1.08 V ~ 3.6 V | 147 | 128K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, USB OTG | - | ROMless | External | ||||
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3,578
In-stock
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NXP USA Inc. | IC MCU 32BIT ROMLESS 516TEPBGA | MPC5121e | Active | Tray | -40°C ~ 85°C (TA) | 516-BBGA Exposed Pad | 516-TEPBGA (27x27) | DMA, WDT | e300 | 400MHz | 1.08 V ~ 3.6 V | 147 | 128K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, USB OTG | - | ROMless | External | ||||
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3,262
In-stock
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NXP USA Inc. | IC MCU 32BIT ROMLESS 256MAPBGA | MCF5301x | Not For New Designs | Tray | -40°C ~ 85°C (TA) | 256-LBGA | 256-MAPBGA | DMA, PWM, WDT | Coldfire V3 | 240MHz | 1.08 V ~ 3.6 V | 83 | 128K x 8 | 32-Bit | EBI/EMI, Ethernet, I²C, Memory Card, SPI, SSI, UART/USART, USB, USB OTG | - | ROMless | Internal | ||||
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4,619
In-stock
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NXP USA Inc. | IC MCU 32BIT ROMLESS 256MAPBGA | MCF5301x | Not For New Designs | Tray | -40°C ~ 85°C (TA) | 256-LBGA | 256-MAPBGA | DMA, PWM, WDT | Coldfire V3 | 240MHz | 1.08 V ~ 3.6 V | 83 | 128K x 8 | 32-Bit | EBI/EMI, Ethernet, I²C, Memory Card, SPI, SSI, UART/USART, USB, USB OTG | - | ROMless | Internal | ||||
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5,508
In-stock
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NXP USA Inc. | IC MCU 32BIT ROMLESS 324BGA | MPC51xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TJ) | 324-BBGA | 324-PBGA (23x23) | DMA, WDT | e300 | 400MHz | 1.08 V ~ 3.6 V | 64 | 32K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, USB OTG | - | ROMless | External | ||||
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4,477
In-stock
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NXP USA Inc. | IC MCU 32BIT ROMLESS 324TEPBGA | MPC51xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TJ) | 324-BBGA | 324-TEPBGA (23x23) | DMA, WDT | e300 | 400MHz | 1.08 V ~ 3.6 V | 64 | 32K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, USB OTG | - | ROMless | External | ||||
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4,494
In-stock
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NXP USA Inc. | IC MCU 32BIT ROMLESS 256MAPBGA | MCF5301x | Not For New Designs | Tray | -40°C ~ 85°C (TA) | 256-LBGA | 256-MAPBGA | DMA, PWM, WDT | Coldfire V3 | 240MHz | 1.08 V ~ 3.6 V | 83 | 128K x 8 | 32-Bit | EBI/EMI, Ethernet, I²C, Memory Card, SPI, SSI, UART/USART, USB, USB OTG | - | ROMless | Internal | ||||
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RFQ |
3,727
In-stock
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Microchip Technology | IC MCU 32BIT 2MB FLASH 128LQFP | SAM4S | Obsolete | Tray | -40°C ~ 85°C (TA) | 128-LQFP | 128-LQFP (14x14) | Brown-out Detect/Reset, DMA, POR, PWM, WDT | ARM® Cortex®-M4 | 120MHz | 1.08 V ~ 3.6 V | 38 | 160K x 8 | 32-Bit | I²C, IrDA, SPI, SSC, UART/USART, USB | 2MB (2M x 8) | Flash | Internal | |||
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3,521
In-stock
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NXP USA Inc. | IC MCU 32BIT ROMLESS 516FPBGA | MPC5121e | Not For New Designs | Tray | -40°C ~ 85°C (TA) | 516-BBGA | 516-FPBGA (27x27) | DMA, WDT | e300 | 400MHz | 1.08 V ~ 3.6 V | 147 | 128K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, USB OTG | - | ROMless | External | ||||
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5,275
In-stock
|
NXP USA Inc. | IC MCU 32BIT ROMLESS 324TEPBGA | MPC51xx | Active | Tray | -40°C ~ 125°C (TJ) | 324-BBGA | 324-TEPBGA (23x23) | DMA, WDT | e300 | 400MHz | 1.08 V ~ 3.6 V | 64 | 32K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, USB OTG | - | ROMless | External | ||||
