- Manufacture :
- Series :
- Operating Temperature :
- Package / Case :
- Supplier Device Package :
- Core Processor :
- Speed :
- Voltage - Supply (Vcc/Vdd) :
- RAM Size :
- Core Size :
- Connectivity :
-
- CAN, C2Slb, I²C, SCI, SPI (1)
- CAN, EBI/EMI, Ethernet, I²C, SPI, SSI, UART/USART, USB, USB OTG (2)
- EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG (3)
- EBI/EMI, Ethernet, I²C, SPI, SSI, UART/USART, USB, USB OTG (1)
- EBI/EMI, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG (2)
- EBI/EMI, I²C, SPI, SSI, UART/USART, USB, USB OTG (1)
- Program Memory Size :
- Program Memory Type :
- Data Converters :
- Oscillator Type :
- Applied Filters :
10 results
| Picture | Mfr Part # | Unit Price | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Speed | Voltage - Supply (Vcc/Vdd) | Number of I/O | RAM Size | Core Size | Connectivity | Program Memory Size | Program Memory Type | EEPROM Size | Data Converters | Oscillator Type | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | |||||||||||||||||||||||||||
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5,438
In-stock
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NXP USA Inc. | IC MCU 32BIT ROMLESS 196MAPBGA | MCF532x | Not For New Designs | Tray | -40°C ~ 85°C (TA) | 196-LBGA | 196-MAPBGA (15x15) | DMA, LCD, PWM, WDT | Coldfire V3 | 240MHz | 1.4 V ~ 3.6 V | 94 | 32K x 8 | 32-Bit | EBI/EMI, I²C, SPI, SSI, UART/USART, USB, USB OTG | - | ROMless | - | - | External | ||||
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4,101
In-stock
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NXP USA Inc. | IC MCU 32BIT ROMLESS 256MAPBGA | MCF532x | Not For New Designs | Tray | -40°C ~ 85°C (TA) | 256-LBGA | 256-MAPBGA | DMA, LCD, PWM, WDT | Coldfire V3 | 240MHz | 1.4 V ~ 3.6 V | 94 | 32K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, SPI, SSI, UART/USART, USB, USB OTG | - | ROMless | - | - | External | ||||
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3,230
In-stock
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NXP USA Inc. | IC MCU 32BIT 512KB FLASH 144BGA | Kinetis K50 | Not For New Designs | Tray | -40°C ~ 85°C (TA) | 144-LBGA | 144-MAPBGA (13x13) | DMA, I²S, LCD, LVD, POR, PWM, WDT | ARM® Cortex®-M4 | 100MHz | 1.71 V ~ 3.6 V | 94 | 128K x 8 | 32-Bit | EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG | 512KB (512K x 8) | Flash | - | A/D 41x16b, D/A 2x12b | Internal | ||||
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3,160
In-stock
|
Texas Instruments | IC MCU 32BIT 384KB FLASH 144LQFP | TMS470 | Not For New Designs | Tray | -40°C ~ 105°C (TA) | 144-LQFP | 144-LQFP (20x20) | DMA, PWM, WDT | ARM7® | 48MHz | 1.71 V ~ 2.05 V | 94 | 32K x 8 | 16/32-Bit | CAN, C2Slb, I²C, SCI, SPI | 384KB (384K x 8) | Flash | - | A/D 12x10b | External | ||||
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5,018
In-stock
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NXP USA Inc. | IC MCU 32BIT 256KB FLASH 144BGA | Kinetis K50 | Not For New Designs | Tray | -40°C ~ 85°C (TA) | 144-LBGA | 144-MAPBGA (13x13) | DMA, I²S, LCD, LVD, POR, PWM, WDT | ARM® Cortex®-M4 | 100MHz | 1.71 V ~ 3.6 V | 94 | 64K x 8 | 32-Bit | EBI/EMI, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG | 256KB (256K x 8) | Flash | - | A/D 41x16b, D/A 2x12b | Internal | ||||
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4,910
In-stock
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NXP USA Inc. | IC MCU 32BIT 256KB FLASH 144LQFP | Kinetis K50 | Not For New Designs | Tray | -40°C ~ 85°C (TA) | 144-LQFP | 144-LQFP (20x20) | DMA, I²S, LCD, LVD, POR, PWM, WDT | ARM® Cortex®-M4 | 100MHz | 1.71 V ~ 3.6 V | 94 | 128K x 8 | 32-Bit | EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG | 256KB (256K x 8) | Flash | 4K x 8 | A/D 41x16b, D/A 2x12b | Internal | ||||
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5,914
In-stock
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NXP USA Inc. | IC MCU 32BIT 512KB FLASH 144LQFP | Kinetis K50 | Not For New Designs | Tray | -40°C ~ 85°C (TA) | 144-LQFP | 144-LQFP (20x20) | DMA, I²S, LCD, LVD, POR, PWM, WDT | ARM® Cortex®-M4 | 100MHz | 1.71 V ~ 3.6 V | 94 | 128K x 8 | 32-Bit | EBI/EMI, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG | 512KB (512K x 8) | Flash | - | A/D 41x16b, D/A 2x12b | Internal | ||||
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2,854
In-stock
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NXP USA Inc. | IC MCU 32BIT 512KB FLASH 144LQFP | Kinetis K50 | Not For New Designs | Tray | -40°C ~ 85°C (TA) | 144-LQFP | 144-LQFP (20x20) | DMA, I²S, LCD, LVD, POR, PWM, WDT | ARM® Cortex®-M4 | 100MHz | 1.71 V ~ 3.6 V | 94 | 128K x 8 | 32-Bit | EBI/EMI, Ethernet, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG | 512KB (512K x 8) | Flash | - | A/D 41x16b, D/A 2x12b | Internal | ||||
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3,034
In-stock
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NXP USA Inc. | IC MCU 32BIT ROMLESS 256MAPBGA | MCF532x | Not For New Designs | Tray | -40°C ~ 85°C (TA) | 256-LBGA | 256-MAPBGA | DMA, LCD, PWM, WDT | Coldfire V3 | 240MHz | 1.4 V ~ 3.6 V | 94 | 32K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, SPI, SSI, UART/USART, USB, USB OTG | - | ROMless | - | - | External | ||||
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3,634
In-stock
|
NXP USA Inc. | IC MCU 32BIT ROMLESS 256MAPBGA | MCF532x | Not For New Designs | Tray | -40°C ~ 85°C (TA) | 256-LBGA | 256-MAPBGA | DMA, LCD, PWM, WDT | Coldfire V3 | 240MHz | 1.4 V ~ 3.6 V | 94 | 32K x 8 | 32-Bit | EBI/EMI, Ethernet, I²C, SPI, SSI, UART/USART, USB, USB OTG | - | ROMless | - | - | External | ||||
