- Manufacture :
- Packaging :
- Operating Temperature :
- Supplier Device Package :
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36 results
| Picture | Mfr Part # | Unit Price | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Speed | Voltage - Supply (Vcc/Vdd) | Number of I/O | RAM Size | Core Size | Connectivity | Program Memory Size | Program Memory Type | EEPROM Size | Data Converters | Oscillator Type | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | |||||||||||||||||||||||||||
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3,074
In-stock
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NXP USA Inc. | KINETIS KL04: 48MHZ CORTEX-M0+ U | Kinetis KL0 | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 24-VFQFN Exposed Pad | 24-QFN (4x4) | Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT | ARM® Cortex®-M0+ | 48MHz | 1.71 V ~ 3.6 V | 22 | 4K x 8 | 32-Bit | I²C, SPI, UART/USART | 32KB (32K x 8) | Flash | - | A/D 12x12b | Internal | ||||
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4,160
In-stock
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NXP USA Inc. | IC MCU 32BIT 32KB FLASH 24QFN | Kinetis KL02 | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 24-VFQFN Exposed Pad | 24-QFN (4x4) | Brown-out Detect/Reset, LVD, POR, PWM, WDT | ARM® Cortex®-M0+ | 48MHz | 1.71 V ~ 3.6 V | 22 | 4K x 8 | 32-Bit | I²C, SPI, UART/USART | 32KB (32K x 8) | Flash | - | A/D 12x12b | Internal | ||||
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4,561
In-stock
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NXP USA Inc. | KINETIS KL03: 48MHZ CORTEX-M0+ U | Kinetis KL03 | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 24-VFQFN Exposed Pad | 24-QFN (4x4) | Brown-out Detect/Reset, LVD, POR, PWM, WDT | ARM® Cortex®-M0+ | 48MHz | 1.71 V ~ 3.6 V | 22 | 2K x 8 | 32-Bit | I²C, SPI, UART/USART | 32KB (32K x 8) | Flash | - | A/D 7x12b | Internal | ||||
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5,179
In-stock
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NXP USA Inc. | KINETIS E 32-BIT MCU ARM CORTEX | Kinetis KEA | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 24-VFQFN Exposed Pad | 24-QFN (4x4) | LVD, POR, PWM, WDT | ARM® Cortex®-M0+ | 48MHz | 2.7 V ~ 5.5 V | 22 | 1K x 8 | 32-Bit | I²C, LIN, SPI, UART/USART | 8KB (8K x 8) | Flash | - | A/D 12x12b | Internal | ||||
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5,059
In-stock
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NXP USA Inc. | KINETIS E 32-BIT MCU ARM CORTEX | Kinetis KEA | Active | Tray | -40°C ~ 105°C (TA) | 24-VFQFN Exposed Pad | 24-QFN (4x4) | LVD, POR, PWM, WDT | ARM® Cortex®-M0+ | 48MHz | 2.7 V ~ 5.5 V | 22 | 1K x 8 | 32-Bit | I²C, LIN, SPI, UART/USART | 8KB (8K x 8) | Flash | - | A/D 12x12b | Internal | ||||
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5,578
In-stock
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NXP USA Inc. | KINETIS E 32-BIT MCU ARM CORTEX | Kinetis KEA | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 24-VFQFN Exposed Pad | 24-QFN (4x4) | LVD, POR, PWM, WDT | ARM® Cortex®-M0+ | 48MHz | 2.7 V ~ 5.5 V | 22 | 1K x 8 | 32-Bit | I²C, LIN, SPI, UART/USART | 8KB (8K x 8) | Flash | - | A/D 12x12b | Internal | ||||
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5,065
In-stock
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NXP USA Inc. | IC MCU 32BIT 8KB FLASH 24QFN | Kinetis KEA | Active | Tray | -40°C ~ 85°C (TA) | 24-VFQFN Exposed Pad | 24-QFN (4x4) | LVD, POR, PWM, WDT | ARM® Cortex®-M0+ | 48MHz | 2.7 V ~ 5.5 V | 22 | 1K x 8 | 32-Bit | I²C, LIN, SPI, UART/USART | 8KB (8K x 8) | Flash | - | A/D 12x12b | Internal | ||||
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2,985
In-stock
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NXP USA Inc. | KINETIS KL03: 48MHZ CORTEX-M0+ U | Kinetis KL03 | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 24-VFQFN Exposed Pad | 24-QFN (4x4) | Brown-out Detect/Reset, LVD, POR, PWM, WDT | ARM® Cortex®-M0+ | 48MHz | 1.71 V ~ 3.6 V | 22 | 2K x 8 | 32-Bit | I²C, SPI, UART/USART | 16KB (16K x 8) | Flash | - | A/D 7x12b | Internal | ||||
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4,084
In-stock
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NXP USA Inc. | KINETIS KE04: 48MHZ CORTEX-M0+ 5 | Kinetis KE04 | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 24-VFQFN Exposed Pad | 24-QFN (4x4) | LVD, PWM, WDT | ARM® Cortex®-M0+ | 48MHz | 2.7 V ~ 5.5 V | 22 | 1K x 8 | 32-Bit | I²C, SPI, UART/USART | 8KB (8K x 8) | Flash | - | A/D 12x12b, D/A 2x6b | Internal | ||||
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2,956
In-stock
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NXP USA Inc. | KINETIS KL05: 48MHZ CORTEX-M0+ U | Kinetis KL0 | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 24-VFQFN Exposed Pad | 24-QFN (4x4) | Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT | ARM® Cortex®-M0+ | 48MHz | 1.71 V ~ 3.6 V | 22 | 4K x 8 | 32-Bit | I²C, SPI, UART/USART | 32KB (32K x 8) | Flash | - | A/D 12x12b, D/A 1x12b | Internal | ||||
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4,282
In-stock
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NXP USA Inc. | IC MCU 32BIT 16KB FLASH 24QFN | Kinetis KL0 | Active | Tray | -40°C ~ 105°C (TA) | 24-VFQFN Exposed Pad | 24-QFN (4x4) | Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT | ARM® Cortex®-M0+ | 48MHz | 1.71 V ~ 3.6 V | 22 | 2K x 8 | 32-Bit | I²C, SPI, UART/USART | 16KB (16K x 8) | Flash | - | A/D 12x12b, D/A 1x12b | Internal | ||||
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3,116
In-stock
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NXP USA Inc. | IC MCU 32BIT 8KB FLASH 24QFN | Kinetis KL0 | Active | Tray | -40°C ~ 105°C (TA) | 24-VFQFN Exposed Pad | 24-QFN (4x4) | Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT | ARM® Cortex®-M0+ | 48MHz | 1.71 V ~ 3.6 V | 22 | 1K x 8 | 32-Bit | I²C, SPI, UART/USART | 8KB (8K x 8) | Flash | - | A/D 12x12b, D/A 1x12b | Internal | ||||
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4,491
In-stock
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NXP USA Inc. | IC MCU 32BIT 16KB FLASH 24QFN | Kinetis KL03 | Active | Tray | -40°C ~ 105°C (TA) | 24-VFQFN Exposed Pad | 24-QFN (4x4) | Brown-out Detect/Reset, LVD, POR, PWM, WDT | ARM® Cortex®-M0+ | 48MHz | 1.71 V ~ 3.6 V | 22 | 2K x 8 | 32-Bit | I²C, SPI, UART/USART | 16KB (16K x 8) | Flash | - | A/D 7x12b | Internal | ||||
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4,295
In-stock
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Microchip Technology | IC MCU 32BIT 16KB FLASH 24QFN | SAM D11D | Active | Cut Tape (CT) | -40°C ~ 105°C (TA) | 24-VFQFN Exposed Pad | 24-QFN (4x4) | Brown-out Detect/Reset, DMA, POR, WDT | ARM® Cortex®-M0+ | 48MHz | 1.62 V ~ 3.63 V | 22 | 4K x 8 | 32-Bit | I²C, LIN, SPI, UART/USART, USB | 16KB (16K x 8) | Flash | - | A/D 10x12b, D/A 1x10b | Internal | ||||
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3,494
In-stock
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Microchip Technology | IC MCU 32BIT 16KB FLASH 24QFN | SAM D10D | Active | Cut Tape (CT) | -40°C ~ 105°C (TA) | 24-VFQFN Exposed Pad | 24-QFN (4x4) | Brown-out Detect/Reset, DMA, POR, WDT | ARM® Cortex®-M0+ | 48MHz | 1.62 V ~ 3.63 V | 22 | 4K x 8 | 32-Bit | I²C, LIN, SPI, UART/USART | 16KB (16K x 8) | Flash | - | A/D 10x12b, D/A 1x10b | Internal | ||||
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2,793
In-stock
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Microchip Technology | IC MCU 32BIT 8KB FLASH 24QFN | SAM D10D | Active | Cut Tape (CT) | -40°C ~ 85°C (TA) | 24-VFQFN Exposed Pad | 24-QFN (4x4) | Brown-out Detect/Reset, DMA, POR, WDT | ARM® Cortex®-M0+ | 48MHz | 1.62 V ~ 3.63 V | 22 | 4K x 8 | 32-Bit | I²C, LIN, SPI, UART/USART | 8KB (8K x 8) | Flash | - | A/D 10x12b, D/A 1x10b | Internal | ||||
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4,562
In-stock
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Microchip Technology | IC MCU 32BIT 8KB FLASH 24QFN | SAM D10D | Active | Cut Tape (CT) | -40°C ~ 105°C (TA) | 24-VFQFN Exposed Pad | 24-QFN (4x4) | Brown-out Detect/Reset, DMA, POR, WDT | ARM® Cortex®-M0+ | 48MHz | 1.62 V ~ 3.63 V | 22 | 4K x 8 | 32-Bit | I²C, LIN, SPI, UART/USART | 8KB (8K x 8) | Flash | - | A/D 10x12b, D/A 1x10b | Internal | ||||
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4,678
In-stock
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NXP USA Inc. | IC MCU 32BIT 16KB FLASH 24QFN | Kinetis KL0 | Active | Tray | -40°C ~ 105°C (TA) | 24-VFQFN Exposed Pad | 24-QFN (4x4) | Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT | ARM® Cortex®-M0+ | 48MHz | 1.71 V ~ 3.6 V | 22 | 2K x 8 | 32-Bit | I²C, SPI, UART/USART | 16KB (16K x 8) | Flash | - | A/D 12x12b | Internal | ||||
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4,043
In-stock
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Microchip Technology | IC MCU 32BIT 16KB FLASH 24QFN | SAM D11D | Active | Tape & Reel (TR) | -40°C ~ 85°C (TA) | 24-VFQFN Exposed Pad | 24-QFN (4x4) | Brown-out Detect/Reset, DMA, POR, WDT | ARM® Cortex®-M0+ | 48MHz | 1.62 V ~ 3.63 V | 22 | 4K x 8 | 32-Bit | I²C, LIN, SPI, UART/USART, USB | 16KB (16K x 8) | Flash | - | A/D 10x12b, D/A 1x10b | Internal | ||||
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3,046
In-stock
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Microchip Technology | IC MCU 32BIT 16KB FLASH 24QFN | SAM D10D | Active | Tape & Reel (TR) | -40°C ~ 85°C (TA) | 24-VFQFN Exposed Pad | 24-QFN (4x4) | Brown-out Detect/Reset, DMA, POR, WDT | ARM® Cortex®-M0+ | 48MHz | 1.62 V ~ 3.63 V | 22 | 4K x 8 | 32-Bit | I²C, LIN, SPI, UART/USART | 16KB (16K x 8) | Flash | - | A/D 10x12b, D/A 1x10b | Internal | ||||
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2,848
In-stock
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NXP USA Inc. | IC MCU 32BIT 8KB FLASH 24QFN | Kinetis KL0 | Active | Tray | -40°C ~ 105°C (TA) | 24-VFQFN Exposed Pad | 24-QFN (4x4) | Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT | ARM® Cortex®-M0+ | 48MHz | 1.71 V ~ 3.6 V | 22 | 1K x 8 | 32-Bit | I²C, SPI, UART/USART | 8KB (8K x 8) | Flash | - | A/D 12x12b | Internal | ||||
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5,764
In-stock
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NXP USA Inc. | IC MCU 32BIT 16KB FLASH 24QFN | Kinetis KL02 | Active | Tray | -40°C ~ 105°C (TA) | 24-VFQFN Exposed Pad | 24-QFN (4x4) | Brown-out Detect/Reset, LVD, POR, PWM, WDT | ARM® Cortex®-M0+ | 48MHz | 1.71 V ~ 3.6 V | 22 | 2K x 8 | 32-Bit | I²C, SPI, UART/USART | 16KB (16K x 8) | Flash | - | A/D 12x12b | Internal | ||||
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2,632
In-stock
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NXP USA Inc. | IC MCU 32BIT 8KB FLASH 24QFN | Kinetis KE04 | Active | Tray | -40°C ~ 105°C (TA) | 24-VFQFN Exposed Pad | 24-QFN (4x4) | LVD, PWM, WDT | ARM® Cortex®-M0+ | 48MHz | 2.7 V ~ 5.5 V | 22 | 1K x 8 | 32-Bit | I²C, SPI, UART/USART | 8KB (8K x 8) | Flash | - | A/D 12x12b, D/A 2x6b | Internal | ||||
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4,752
In-stock
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Microchip Technology | IC MCU 8BIT 16KB FLASH 24QFN | tinyAVR™ 1 | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 24-VFQFN Exposed Pad | 24-QFN (4x4) | Brown-out Detect/Reset, POR, PWM, WDT | AVR | 20MHz | 1.8 V ~ 5.5 V | 22 | 2K x 8 | 8-Bit | I²C, IrDA, LIN, SPI, UART/USART | 16KB (16K x 8) | Flash | 256 x 8 | A/D 24x10b, D/A 3x8b | Internal | ||||
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4,572
In-stock
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Microchip Technology | IC MCU 8BIT 8KB FLASH 24QFN | tinyAVR™ 1 | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 24-VFQFN Exposed Pad | 24-QFN (4x4) | Brown-out Detect/Reset, POR, WDT | AVR | 20MHz | 1.8 V ~ 5.5 V | 22 | 512 x 8 | 8-Bit | I²C, IrDA, LIN, SPI, UART/USART | 8KB (8K x 8) | Flash | 128 x 8 | A/D 12x10b, D/A 1x8b | Internal | ||||
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3,848
In-stock
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Microchip Technology | IC MCU 8BIT 16KB FLASH 24QFN | tinyAVR™ 1 | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 24-VFQFN Exposed Pad | 24-VQFN (4x4) | Brown-out Detect/Reset, POR, PWM, WDT | AVR | 20MHz | 1.8 V ~ 5.5 V | 22 | 2K x 8 | 8-Bit | I²C, IrDA, LIN, SPI, UART/USART | 16KB (16K x 8) | Flash | 256 x 8 | A/D 24x10b, D/A 3x8b | Internal | ||||
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4,119
In-stock
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Microchip Technology | IC MCU 8BIT 8KB FLASH 24QFN | tinyAVR™ 1 | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 24-VFQFN Exposed Pad | 24-QFN (4x4) | Brown-out Detect/Reset, POR, WDT | AVR | 20MHz | 1.8 V ~ 5.5 V | 22 | 512 x 8 | 8-Bit | I²C, IrDA, LIN, SPI, UART/USART | 8KB (8K x 8) | Flash | 128 x 8 | A/D 12x10b, D/A 1x8b | Internal | ||||
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4,310
In-stock
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NXP USA Inc. | IC MCU 32BIT 32KB FLASH 24QFN | Kinetis KL0 | Active | Tray | -40°C ~ 105°C (TA) | 24-VFQFN Exposed Pad | 24-QFN (4x4) | Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT | ARM® Cortex®-M0+ | 48MHz | 1.71 V ~ 3.6 V | 22 | 4K x 8 | 32-Bit | I²C, SPI, UART/USART | 32KB (32K x 8) | Flash | - | A/D 12x12b | Internal | ||||
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4,607
In-stock
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NXP USA Inc. | IC MCU 32BIT 32KB FLASH 24QFN | Kinetis KL03 | Active | Tray | -40°C ~ 105°C (TA) | 24-VFQFN Exposed Pad | 24-QFN (4x4) | Brown-out Detect/Reset, LVD, POR, PWM, WDT | ARM® Cortex®-M0+ | 48MHz | 1.71 V ~ 3.6 V | 22 | 2K x 8 | 32-Bit | I²C, SPI, UART/USART | 32KB (32K x 8) | Flash | - | A/D 7x12b | Internal | ||||
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3,902
In-stock
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Microchip Technology | 20MHZ,8KB,QFN24,IND 125C,GREEN | tinyAVR™ 1 | Active | Tray | -40°C ~ 125°C (TA) | 24-VFQFN Exposed Pad | 24-QFN (4x4) | Brown-out Detect/Reset, POR, WDT | AVR | 20MHz | 1.8 V ~ 5.5 V | 22 | 512 x 8 | 8-Bit | I²C, IrDA, LIN, SPI, UART/USART | 8KB (8K x 8) | Flash | 128 x 8 | A/D 12x10b, D/A 1x8b | Internal | ||||
