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17 results
| Picture | Mfr Part # | Unit Price | QUANTITY | Inventory | MANUFACTURE | Description | Package | Series | Part Status | Packaging | Operating Temperature | Mounting Type | Termination | Features | Height Above Board | Material Flammability Rating | Number of Positions | Contact Finish | Pitch | Voltage Rating | Contact Material | Housing Material | Flat Flex Type | Connector/Contact Type | FFC, FCB Thickness | Locking Feature | Cable End Type | Actuator Material | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| GLOBAL STOCKS | |||||||||||||||||||||||||||||
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4,390
In-stock
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JAE Electronics | CONN FPC BOTTOM 50POS 0.50MM SMD | FA5 | Active | Tray | -40°C ~ 85°C | Board Edge, Cutout | Solder | Solder Retention, Zero ion Force (ZIF) | - | UL94 V-0 | 50 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | FPC | Contacts, Bottom | 0.30mm | Flip Lock | Tapered | Polyamide (PA), Nylon, Glass Filled | ||||
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3,308
In-stock
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JAE Electronics | CONN FPC BOTTOM 40POS 0.50MM SMD | FA5 | Active | Tape & Reel (TR) | -40°C ~ 85°C | Board Edge, Cutout | Solder | Solder Retention, Zero ion Force (ZIF) | - | UL94 V-0 | 40 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | FPC | Contacts, Bottom | 0.30mm | Flip Lock | Tapered | Polyamide (PA), Nylon, Glass Filled | ||||
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4,722
In-stock
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JAE Electronics | CONN FPC BOTTOM 50POS 0.50MM SMD | FA5 | Active | Tray | -40°C ~ 85°C | Board Edge, Cutout | Solder | Solder Retention, Zero ion Force (ZIF) | - | UL94 V-0 | 50 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | FPC | Contacts, Bottom | 0.30mm | Flip Lock | Tapered | Polyamide (PA), Nylon, Glass Filled | ||||
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4,841
In-stock
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JAE Electronics | CONN FPC BOTTOM 45POS 0.50MM SMD | FA5 | Active | Tray | -40°C ~ 85°C | Board Edge, Cutout | Solder | Solder Retention, Zero ion Force (ZIF) | - | UL94 V-0 | 45 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | FPC | Contacts, Bottom | 0.30mm | Flip Lock | Tapered | Polyamide (PA), Nylon, Glass Filled | ||||
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4,867
In-stock
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JAE Electronics | CONN FPC BOTTOM 30POS 0.50MM SMD | FA5 | Active | Tray | -40°C ~ 85°C | Board Edge, Cutout | Solder | Solder Retention, Zero ion Force (ZIF) | - | UL94 V-0 | 30 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | FPC | Contacts, Bottom | 0.30mm | Flip Lock | Tapered | Polyamide (PA), Nylon, Glass Filled | ||||
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3,251
In-stock
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JAE Electronics | CONN FPC BOTTOM 50POS 0.50MM SMD | FA5 | Active | Tape & Reel (TR) | -40°C ~ 85°C | Board Edge, Cutout | Solder | Solder Retention, Zero ion Force (ZIF) | - | UL94 V-0 | 50 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | FPC | Contacts, Bottom | 0.30mm | Flip Lock | Tapered | Polyamide (PA), Nylon, Glass Filled | ||||
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5,706
In-stock
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JAE Electronics | CONN FPC BOTTOM 30POS 0.50MM SMD | FA5 | Active | Tray | -40°C ~ 85°C | Board Edge, Cutout | Solder | Solder Retention, Zero ion Force (ZIF) | - | UL94 V-0 | 30 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | FPC | Contacts, Bottom | 0.30mm | Flip Lock | Tapered | Polyamide (PA), Nylon, Glass Filled | ||||
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2,745
In-stock
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JAE Electronics | CONN FPC BOTTOM 20POS 0.50MM SMD | FA5 | Active | Tray | -40°C ~ 85°C | Board Edge, Cutout | Solder | Solder Retention, Zero ion Force (ZIF) | - | UL94 V-0 | 20 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | FPC | Contacts, Bottom | 0.30mm | Flip Lock | Tapered | Polyamide (PA), Nylon, Glass Filled | ||||
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5,780
In-stock
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JAE Electronics | CONN FPC BOTTOM 36POS 0.50MM SMD | FA5 | Active | Tray | -40°C ~ 85°C | Board Edge, Cutout | Solder | Solder Retention, Zero ion Force (ZIF) | - | UL94 V-0 | 36 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | FPC | Contacts, Bottom | 0.30mm | Flip Lock | Tapered | Polyamide (PA), Nylon, Glass Filled | ||||
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5,103
In-stock
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JAE Electronics | CONN FPC BOTTOM 8POS 0.50MM SMD | FA5 | Active | Tray | -40°C ~ 85°C | Board Edge, Cutout | Solder | Solder Retention, Zero ion Force (ZIF) | - | UL94 V-0 | 8 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | FPC | Contacts, Bottom | 0.30mm | Flip Lock | Tapered | Polyamide (PA), Nylon, Glass Filled | ||||
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3,437
In-stock
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JAE Electronics | CONN FPC BOTTOM 16POS 0.50MM SMD | FA5 | Active | Tray | -40°C ~ 85°C | Board Edge, Cutout | Solder | Solder Retention, Zero ion Force (ZIF) | - | UL94 V-0 | 16 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | FPC | Contacts, Bottom | 0.30mm | Flip Lock | Tapered | Polyamide (PA), Nylon, Glass Filled | ||||
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2,639
In-stock
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JAE Electronics | CONN FPC BOTTOM 6POS 0.50MM SMD | FA5 | Active | Tray | -40°C ~ 85°C | Board Edge, Cutout | Solder | Solder Retention, Zero ion Force (ZIF) | - | UL94 V-0 | 6 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | FPC | Contacts, Bottom | 0.30mm | Flip Lock | Tapered | Polyamide (PA), Nylon, Glass Filled | ||||
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5,831
In-stock
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JAE Electronics | CONN FPC BOTTOM 30POS 0.50MM SMD | FA5 | Active | Tape & Reel (TR) | -40°C ~ 85°C | Board Edge, Cutout | Solder | Solder Retention, Zero ion Force (ZIF) | - | UL94 V-0 | 30 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | FPC | Contacts, Bottom | 0.30mm | Flip Lock | Tapered | Polyamide (PA), Nylon, Glass Filled | ||||
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3,846
In-stock
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JAE Electronics | CONN FPC BOTTOM 8POS 0.50MM SMD | FA5 | Active | Tape & Reel (TR) | -40°C ~ 85°C | Board Edge, Cutout | Solder | Solder Retention, Zero ion Force (ZIF) | - | UL94 V-0 | 8 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | FPC | Contacts, Bottom | 0.30mm | Flip Lock | Tapered | Polyamide (PA), Nylon, Glass Filled | ||||
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5,949
In-stock
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JAE Electronics | CONN FPC BOTTOM 10POS 0.50MM SMD | FA5 | Active | Tray | -40°C ~ 85°C | Board Edge, Cutout | Solder | Solder Retention, Zero ion Force (ZIF) | - | UL94 V-0 | 10 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | FPC | Contacts, Bottom | 0.30mm | Flip Lock | Tapered | Polyamide (PA), Nylon, Glass Filled | ||||
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3,601
In-stock
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JAE Electronics | CONN FPC BOTTOM 8POS 0.50MM SMD | FA5 | Active | Tape & Reel (TR) | -40°C ~ 85°C | Board Edge, Cutout | Solder | Solder Retention, Zero ion Force (ZIF) | - | UL94 V-0 | 8 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | FPC | Contacts, Bottom | 0.30mm | Flip Lock | Tapered | Polyamide (PA), Nylon, Glass Filled | ||||
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4,470
In-stock
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JAE Electronics | CONN FPC BOTTOM 40POS 0.50MM SMD | FA5 | Active | Tray | -40°C ~ 85°C | Board Edge, Cutout | Solder | Solder Retention, Zero ion Force (ZIF) | - | UL94 V-0 | 40 | Gold | 0.020" (0.50mm) | 50V | Copper Alloy | Liquid Crystal Polymer (LCP), Glass Filled | FPC | Contacts, Bottom | 0.30mm | Flip Lock | Tapered | Polyamide (PA), Nylon, Glass Filled | ||||
